Automatic Semiconductor Terminator (Chip Capacitor) Machine

Automatic Semiconductor Terminator (Chip Capacitor) machine

Introduction

• it has automatic gluing and automatic product implantation, with an implantation rate of more than 98%. It has the function of automatic cleaning of the upper and lower parts of the board after implantation and before leveling, and the product crosses the area to be tested on the board surface.
• it has the functions of automatic slurry feeding and digital control of slurry height. During slurry laying, it has the function of slurry laying line detection and alarm (detection accuracy is 0.1mm), and the flatness accuracy of slurry tray is ≤± 0.005mm.
• the flatness of the blade edge of the scraper shall be ≤± 0.005mm, wear-resistant and rust free; The relative parallelism between the pulp tray and the carrier is ≤± 0.005mm.
• applicable to product specifications and dimensions: automatic production of British 0201-1206 products.
• the drying furnace adopts the three temperature zone hot air circulation "Ferris wheel" rotation mode for drying, which has the characteristics of large capacity, uniform heating, fast drying and high temperature control accuracy
• the whole machine can be remotely controlled to detect equipment fault points and handle them in time to improve maintenance and production efficiency.

PARAMETER FORM

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